Thermal Shock
EquipmentThermal Shock Test
ES-66EX-L
Introduction
Reliability test for user environments with large temperature changes Semiconductor certification criteria
Application
This is an essential criteria for semiconductor qualification in various fields such as MIL-STD, JEDEC, AEC, etc.
The Equipment
Thermal Shock Test
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Test Method
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The Thermal Shock (Ts) is a test that assesses 1) whether the product can withstand high and low temperature conditions and 2) how it is affected by repeated exposure to high and low temperatures. Defects caused by repeated thermal mechanical loads belong to a fatigue failure, and the TC test accelerates this fatigue failure. The test procedure consists of mounting the sample in a TC chamber and repeatedly exposing it to prescribed levels of high and low temperature. While temperature cycle (TC) test uses air as the heat transfer medium, the TS uses Liquid.
DATA EXAMPLE
Repetitive changes in temperature causes stress in the interface because components expand and contract differently
Technical Use Case
Related Standards
- JESD22-A106
- MIL-STD883 M1011.9