Tear-down & Detach
EquipmentTear-down & Detach
The process of extracting semiconductor devices by disassembling products
Introduction
This is a sample pretreatment process to understand the technical principles and structure of the component by disassembling the product to check its components and by extracting the SMT components on the PCB Board.
Application
Benchmarking, Reverse Engineering
Technical Use Case
QUICK-KOREA社 / QUICK-KOREA390D
Contact Point
Person in charge
DMA Team (FA Lab.)
- • TEL.
- 010-6400-8094
- • E-mail.
- ec.fa@qrtkr.com