BLR TC Equipment
EquipmentSJR Temperature
Cycling Equipment
Board Level Reliability Temperature Cycling Test
This equipment is used to evaluate the reliability of solder joints by inducing stress by changing ambient temperature.
Introduction
The products lifetime is evaluated by changing the ambient temperature to accelerate the aging of solder joints and by observing the stress that occurs by the difference in thermal expansion between the product and PCB. This environment is simulated by changing the level of temperature, exposure to various temperatures and the temperature change ratio
Application
It is used to evaluate the reliability and life of solder joints in portable electronic devices such as smartphones and vehicle electronic components.
The Equipment
- Equipment
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• Temperature Range : 170 ~ -55 ℃
• Ramp rate : Max 20 ℃/min
Technical Use Case
- Related Testing Spec
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• JESD22-A104
• AEC Q104
Reliability Testing Service Category based on Applications
Appendix
※ Failure Analysis DATA : Cross-Section, Dye & Pry
Component and PCB connected Board Level is used to evaluate the lifetime and tolerance of Solder Joints.
Major Evaluation Criteria
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01.
BLR Drop Test [ JESD22-B111 ]
Evaluating the effects of a drop impact. -
02.
BLR Temperature Cycling Test [ JESD22-A104 ]
Evaluating the effects of thermal expansion differences caused by temperature changes. -
03.
BLR Temperature Humidity Storage Test [ JESD22-A101 ]
Evaluating stress in high temperature and high humidity environments. -
04.
BLR Cyclic Bending Test [ JESD22-B113 ]
Evaluating the effects of repeated bending. -
05.
BLR Vibration Test [ JESD22-B103 ]
Evaluating the effects of the vibration exposed during product transportation.
※ In addition to the key evaluation criteria, you can simulate defects that may occur in the process or field to evaluate the reliability of the solder joint.