BLR THS Equipment
EquipmentTemperature Humidity Storage Test
This equipment allows the product to be exposed to constant temperature and humidity for long periods of time.
Introduction
The equipment simulates the effects of stress(hot and humid environments) exposed to the solder joint during storage, transportation or use.
Application
It is used to evaluate the heat and humidity tolerance of solder joints in portable electronic devices such as smartphones and vehicle electronic components.
The Equipment
- Equipment
-
Temperature Range : 100 ~ -20 ℃
R.H Range : 40 ~ 98 % RH
Technical Use Case
- Related Testing Spec
-
JESD22-A101
Reliability Testing Service Category based on Applications
Appendix
※ Failure Analysis DATA : Cross-Section, Dye & Pry
Component and PCB connected Board Level is used to evaluate the lifetime and tolerance of Solder Joints.
Major Evaluation Criteria
-
01.
BLR Drop Test [ JESD22-B111 ]
Evaluating the effects of a drop impact. -
02.
BLR Temperature Cycling Test [ JESD22-A104 ]
Evaluating the effects of thermal expansion differences caused by temperature changes. -
03.
BLR Temperature Humidity Storage Test [ JESD22-A101 ]
Evaluating stress in high temperature and high humidity environments. -
04.
BLR Cyclic Bending Test [ JESD22-B113 ]
Evaluating the effects of repeated bending. -
05.
BLR Vibration Test [ JESD22-B103 ]
Evaluating the effects of the vibration exposed during product transportation.
※ In addition to the key evaluation criteria, you can simulate defects that may occur in the process or field to evaluate the reliability of the solder joint.