Dye & Pry
EquipmentDye & Pry
An analysis to check solder defects by applying ink to SMT applied IC
Introduction
This analytical technique can be used to check solder defects by applying permeable ink to the SMT applied IC and solidifying it, then physically removing the IC to check for defects depending on the level of ink penetration in the solder area.
Application
Solder Cracks detection
Technical Use Case
Dye & Pry
Contact Point
Person in charge- • TEL.
- 010-6400-8094
- • E-mail.
- ec.fa@qrtkr.com
Bonding Cratering
EquipmentBonding Cratering
An analysis for crack identification in areas under the bonding wire such as Alpad and IMD Layers.
Introduction
To analyse if the fault of the bonding wire process caused a crack in the Alpad and IMD layer, chemicals can be used for de-capsulation and wire etching to observe those cracks.
Application
Al pad and IMC Crack detection
Technical Use Case
Bonding Cratering
Contact Point
Person in charge- • TEL.
- 010-6400-8094
- • E-mail.
- ec.fa@qrtkr.com
Passivation Integrity
EquipmentPassivation Integrity
An analysis to detect passivation damage using chemical substances
Introduction
This analysis detects damage(cracks) in the Passivation caused by the EMC Filler and process. If there is a crack in the passivation, it can be detected by penetrating chemicals through the crack area to discolor the metal.
Application
Passivation damage detection
Technical Use Case
Passivation Integrity
Contact Point
Person in charge- • TEL.
- 010-6400-8094
- • E-mail.
- ec.fa@qrtkr.com