Bonding Test System
EquipmentBonding Test Equipment
Nordson dage/ 4000PLUS
A shear test of component level products by conducting wire bond pull, shear and solder ball pull
Introduction
It is used to test the durability of the joint of the product against physical shear stresses that may occur during manufacturing, handling, testing, transportation and end-use conditions. Wire bond shear (pull) test is conducted after the DECAP process removes epoxy from IC chip. The Solder Ball Shear test is conducted to all surface mounted packages except flip chips and is carried out in the pre-implementation phase of the PCB. Each solder ball must be sheared individually, and data of shear stress and failure types are collected and analysed. In the case of automotive electronic components, solder bonding strength of PCB soldering electronics is examined after a reliability test, and the average bonding strength of each element is determined by the change in bonding strength compared to the previous one.
Application
Solder bonding strength test for automotive electronic components.
The Equipment
Bonding Test System
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- Manufacturer / Model
Nordson dage/ 4000PLUS
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- USE
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Product's Component Level Wire bond pull, shear and Solder ball pull, shear testing
Solder Bonding Test for Automobile Electric Component
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- Equipment Spec
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Shear Range : 100 ~ 800 um/sec
Pull Range : 100 um/sec
Test Method
It is used to test the durability of the joint of the product against physical shear stresses that may occur during manufacturing, handling, testing, transportation and end-use conditions. Wire bond shear (pull) test is conducted after the DECAP process removes epoxy from IC chip. The Solder Ball Shear test is conducted to all surface mounted packages except flip chips and is carried out in the pre-implementation phase of the PCB. Each solder ball must be sheared individually, and data of shear stress and failure types are collected and analysed. In the case of automotive electronic components, solder bonding strength of PCB soldering electronics is examined after a reliability test, and the average bonding strength of each element is determined by the change in bonding strength compared to the previous one.
DATA EXAMPLE
Before test
After test
Before test
After test
Technical Use Case
Related Standards
- JESD22-B117B
- AEC Q100
- MIL-STD883 Method 2011
- ES900000-04