메인으로

This test is used to evaluate the physical effects of the semiconductor component from the stress caused by centrifugal force. This is an accelerated assessment test designed to identify structural and mechanical vulnerabilities of the product that was undetected by the shock and vibration test. The test can be applied as a destruction test by applying a high level of stress to determine the mechanical limit of the product's package, internal metal, lead, die and substrate. This assessment can be used as a means of pre-removing products with lower mechanical properties, and is considered a mandatory assessment, especially for automotive parts crucial for human safety.

Evaluation of rotational and constant acceleration of vehicles and U.S. Defense Component Level products.