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Deterioration of lead and terminal in semiconductors reduces the quality of the overall soldering process during parts assembly. It can become a cause of defects when the product is put to practical use.

Depending on the product, solderability can be evaluated by using different methods listed below

The Dip & Look evaluation is a method used to observe the wetting pattern of the semiconductor component when immersed and taken out of molten solder. This is a typical evaluation method required by all semiconductor specifications, and is easier to apply than other evaluations.
(Type : Through-Hole, Leadless, Leaded)

The wetting balance method is carried out using high accuracy equipment and can be applied to both PTH and SMD type components. The wettability of lead can be determined by verifying the parameters of wetting curve recorded when the surface tension of the molten solder changes.
(Type : Through-Hole, Leadless, Leaded)

Surface mount process simulation is a method that simulates the reflow process environment when SMD parts are mounted on the board. In comparison to the standard Dip&Look evaluation, this method is more appropriate when immersing SMD components into molten solder, and can even evaluate components such as BGA, which are harder to apply solder dipping, such as BGA.
(Type: Leadless, Led, BGA)