Temperature Cycling
EquipmentTemperature Cycling Test
HITACHI / EC-25EXTH
Introduction
Reliability test for user environments with large temperature changes Semiconductor certification criteria
Application
This is an essential criteria for semiconductor qualification in various fields such as MIL-STD, JEDEC, AEC, etc. It is used to predict basic reliability through temperature cycle tests as well as high temperature operation tests depending on the user environment.
The Equipment
Temperature Cycling Test
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- Manufacturer / Model
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HITACHI / EC-25EXTH
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- USE
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Reliability Testing of User Environment with Large Changes in Temperature
Semiconductor Verification Test Category
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- Equipment Spec
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Ramp rate:
5 Minutes with Recovery Mode Ambient Temp. Change 5~15℃ / min @ Soak Mode
Test Method
The Temperature Cycle (TC) is a test that assesses 1) whether the product can withstand high and low temperature conditions and 2) how it is affected by repeated exposure to high and low temperatures. Defects caused by repeated thermal mechanical loads belong to a fatigue failure, and the TC test accelerates this fatigue failure. Like TC, the Thermal Shock test is also a fatigue acceleration test. The test procedure consists of mounting the specimen in a TC chamber and repeatedly exposing it to prescribed levels of high and low temperatures.
DATA EXAMPLE
Repeated temperature changes causes stress at the interface due to different degrees of shrinkage and expansion between materials
Technical Use Case
Related Standards
- JESD22-A104
- MIL-STD883 M1010