Highly Accelerated Stress Test
EquipmentHighly Accelerated Stress Test
HIRAYAMA / PC422R8D
Introduction
Reliability test for high temperature and high humidity Environments Evaluation of corrosion and migration tolerance of metal elements in semiconductors
Application
The most common environment in which electronics operate is in hot and humid environments. Metal elements inside the semiconductor can be corroded or migrated if poorly sealed, so the tolerance against the defective mechanism can be evaluated through THB testing.
The Equipment
Highly Accelerated Stress Test
-
- Manufacturer / Model
-
HIRAYAMA / PC422R8D
-
- USE
-
Provides Handling Cautions of Semiconductor Manufacturing Procedure
Pretreatment for Temperature, Moisture related Reliability Test Evaluation
Delamination/Crack Evalution of High-temperature Soldering Process
-
- Equipment Spec
-
Temperature Range :
Humidity Range :
Vapor Pressure :
122 kPa @ 130℃, 85% R.H 122 kPa @ 110℃, 85% R.H
Test Method
The HAST (Highly Accelerated Stress Test) is a test developed to make a faster test than the Temperature Humidity Bias (THB) Test. While the THB test takes 1000 hours, HAST can obtain results within 96 to 264hours. For this reason, HAST is being widely used recently. Like the THB, HAST also accelerates the corrosion in the die's metal line and thin film resistor. The test is run for 96 to 264 hours under the temperature of 130°C and relative humidity of 85% with preconditioning and bias applied before the HAST.
DATA EXAMPLE
-
01.
Power dissipation is minimized so that moisture can stay on the die surface.
-
02.
Apply crossing pins of opposite bias (low voltage and high voltage) if possible.
-
03.
Maximise the potential difference between the die metalizations.
-
04.
Maximise the operating voltage level with in levels of power dissipation that can be controlled.
Technical Use Case
Related Standards
- JESD22-A110
- JESD22-A118