Temperature Humidity Bias
EquipmentHigh Temperature High Humidity Bias Test
HITACHI / EC-86HHP
Temperature Humidity Bias
Introduction
Reliability test for high temperature and high humidity Environments Evaluation of corrosion and migration tolerance of metal elements in semiconductors
Application
The most common environment in which electronics operate is in hot and humid environments. Metal elements inside the semiconductor can be corroded or migrated if poorly sealed, so the tolerance against the defective mechanism can be evaluated through THB testing.
The Equipment
High Temperature High Humidity Bias Test
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- Manufacturer / Model
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HITACHI / EC-86HHP
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- USE
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Provides Handling Cautions of Semiconductor Manufacturing Procedure
Pretreatment for Temperature, Moisture related Reliability Test Evaluation
Delamination/Crack Evalution of High-temperature Soldering Process
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- Equipment Spec
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Temperature Range : -20℃ ~ 100℃
Humidity Range : 20% ~ 98%RH
Test Method
Different package shapes show different characteristics in water ingression. Thick through-hole packages tend to absorb more moisture per unit volume than thin SMD packages. A problem occurs when moisture penetrates and stays inside the package, and sudden exposure to high temperature(e.g. mounting process) stresses the package. Package cracks caused by moisture are called popcorn cracking. In general, surface-mounted products (SMDs) have a higher probability of popcorn cracking due to the such factors.
DATA EXAMPLE
Technical Use Case
Related Standards
- JESD22-A101